Method of customizing integrated circuits using standard masks and targeting energy beams

ABSTRACT

A method for fabricating custom integrated circuits includes the steps of 1) patterning the layer to be customized with standard precision masking techniques to define all possible connections, vias or cut-points, and 2) using a non-precision targeting energy beam to select the desired connections, vias or cut-points for customization. Consequently, the present invention requires no custom mask so that application specific integrated circuits (ASICs) can be produced with lower lead-time and costs when compared to prior methods. In other embodiments, a non-precision configuration mask may replace the targeting energy beam, where the configuration mask can be made by conventional mask-making techniques or by applying an opaque layer to a mask blank and using a targeting energy beam to selectively remove the desired portions of the opaque areas.

FIELD OF THE INVENTION

The present invention relates to methods of patterning photoresist, andmore particularly to methods for combining precision and non-precisionphotolithography processes to customize integrated circuits.

BACKGROUND OF THE INVENTION

Custom or application specific-integrated circuits (ASICs) arefrequently used to implement new circuit designs. The fabricationprocess for an integrated circuit (IC) includes the following basicsteps:

1) form a layer of conductive or insulative material on the uppersurface of a silicon or semiconductor wafer;

2) coat the surface of the wafer with a photoresist (positive ornegative), which is then cured and dried;

3) expose the photoresist to an intense light source through a precisionmask to define specific patterns on the wafer;

4) develop the resist to remove portions not selected by irradiationthrough the mask (exposed portions if a positive resist is used,unexposed portions if a negative resist is used);

5) etch away the portion of the layer exposed by the removed portions ofthe resist;

6) remove the remaining resist;

7) repeat steps 1-6 for each layer formed on the IC.

One consequence of this fabrication process is that several precisioncustom masks may be required for each IC. Because precision custom masksare costly to manufacture, a large quantity of each IC must be producedin order for the fabrication process to be economical. However, astechnology advances, circuit designs become more application-specificand are typically required at a much lower volume than the more genericICs, thus making fabrication of such application-specific ICs moreexpensive. This need for lower cost per unit ASICs and other needs ofthe ASIC manufacturer and user are not being met with the conventionalfabrication process.

The objectives of the ASIC user and manufacturer fall into four primarycategories. One objective is the ability to feasibly manufacture a smallnumber of prototype units (i.e., one or two units). This keeps designcosts low because only the required number of test units aremanufactured, thereby saving costs for unused and unneeded units. Asecond objective is to minimize the costs of each iterated test unitbecause a single application may require numerous prototype units fortesting and modification. A third objective for the ASIC user is toreduce the lead-time to produce both prototype and production units inorder for the design to be quickly developed and placed into productionas soon as possible, thereby shortening the time-to-market schedule forthe final circuit design. A fourth objective is to minimize costs forboth prototype and production units, regardless of the numbermanufactured.

In an attempt to meet these objectives, a current practice is to usegate arrays to customize integrated circuits. Gate arrays aremass-produced integrated circuits containing generic arrays of circuitelements ("gate array blanks"), which can be customized intoapplication-specific ICs with a small number of masks defining custominterconnections of the circuit elements at the final steps offabrication. The gate array blanks can be manufactured up to thecustomization steps and stored away until an order for a particularapplication-specific circuit is received.

Typically, in a two-layer metal technology, customizing the gate arrayblank requires processing three layers: a first metal layer, aninsulation layer, and a second metal layer, in that order. The basicsteps are as follows:

1) deposit the first metal layer on a contact layer, which connects thefirst metal layer to the circuit elements below;

2) coat the first metal layer with resist, which is then cured anddried;

3) expose the resist through an application-specific mask;

4) develop the resist to remove the unwanted portions of the resist,i.e., the desired electrical connection portions;

5) etch the uncovered portions of the first metal layer;

6) remove the remaining resist;

7) deposit the insulation layer on the first metal layer;

8) coat the insulation layer with resist, which is then cured and dried;

9) expose the resist through another custom mask;

10) develop the resist and remove the unwanted portions;

11) etch the uncovered portions of the insulation layer to form openings("vias") in the insulation layer for connecting the first and secondmetal layers;

12) remove the remaining resist;

13) deposit the second metal layer on the insulation layer allowing thedeposited metal to fill the vias;

14) coat the second metal layer with resist, which is then cured anddried;

15) expose the resist through another custom mask;

16) develop the resist to remove the unwanted portions;

17) etch the uncovered portions of the second metal layer;

18) remove the remaining resist;

19) deposit a passivation layer on the second metal layer; and

20) configure the passivation layer using a general purpose mask toprovide connections to the ASIC thus formed.

Therefore, gate array processing reduces cost and lead-time tomanufacture ASICS. However, even though gate array processing meetsportions of the third and fourth objectives, the other objectives arenot met due to the high costs of precision configuration masks.Furthermore, the need for precision configuration masks limits theextent that costs and lead-time can be reduced.

An alternative method is to use direct write-on-wafer technology on gatearray processing to replace the steps requiring custom configurationmasks. However, using programmable direct-write machines can still incursubstantial costs to the manufacture of prototype and production ASICs.Electron beam (E-beam) direct-write technology employs high-costequipment with a low throughput. On the other hand, laser-baseddirect-write systems do not have the resolution needed to meet theperformance and total die size requirements of present designs. Eventhough less expensive than E-beam systems, laser based systems are stillmore expensive and of lower precision than standard optical reductionsteppers or other comparable methods using a standard set of precisionphoto-masks.

Accordingly, it is desirable to have a fabrication process forcustomizing integrated circuits without the drawbacks of conventionalmethods for reducing both lead-time and costs of designing andmanufacturing ASICS.

SUMMARY OF THE INVENTION

According to the present invention, a method is provided for customizingintegrated circuits by combining precision and non-precision lithographywithout the need of a precision configuration mask, thereby reducingcosts, complexity, and lead-time for fabricating an application specificintegrated circuit (ASIC).

In an embodiment of the present invention for patterning photoresistopenings, negative photoresist is applied to a wafer or other structure.The resist is exposed through a precision mask or by other precisiontechniques in all areas except where possible openings will exist. Thesize, location, and shape of the possible openings are determined by theprecision mask. A laser direct-write machine or other non-precisiondirect-write technique (hereinafter referred generally as "laser") isthen used to expose areas, typically larger than the openings, which arenot to be subsequently acted upon. The resist is then developed touncover the openings not selected by either the mask or laser, i.e., thelogical NOR of the mask opening areas and the laser spots. The devicemay then be etched or acted upon through these openings.

In another embodiment for patterning photoresist openings, positiveresist is used to coat the device. The resist is exposed at all possibleopenings through a precision mask, which defines the size and shape ofthe possible openings. However, the time and energy of the precisionmask exposure is kept below the threshold for complete exposure of theresist, which is generally referred to as the clearing energy of theresist. A laser then exposes locations on the resist overlapping areaswhere openings are desired. The time and energy of the laser exposure isinsufficient to fully expose the resist by itself, but is sufficientwhen combined with the mask exposure step. The resist is then developedto uncover openings exposed by both the mask and laser, i.e., thelogical AND of the two exposure steps. The device can then be etched oracted upon based on the resist pattern.

In another embodiment of the present invention, lines and specificlocations of potential cut points for disconnecting the lines arepatterned on a positive resist layer. The resist is exposed through astandard precision mask to define lines (unexposed) and spaces(exposed). A laser then exposes selected cut points within the lines andthe resist is developed to uncover areas exposed by the mask or thelaser, i.e., a logical OR of the mask open areas and laser patterns. Thedevice may then be etched or acted upon accordingly.

Another embodiment of the present invention patterns lines with possibleconnection points between lines on negative photoresist. The resist isexposed through a precision mask to define lines (exposed) where theresist is to cover the structure and gaps (unexposed) where the resistis to be removed. A laser exposes additional areas between lines whereresist is desired to cover the structure, creating selected additionalconnections between lines. The resist is developed and areas of theresist left unexposed by the mask or laser are removed for a logical ORof the mask and laser patterns. Etching or other processing can then beperformed on the patterned resist.

In another embodiment of the present invention, two resist layers areused to pattern a device. A first layer of positive or negative resistis deposited on the device. The first layer is exposed through aprecision mask (with corresponding changes in the mask polaritydepending on the resist polarity) to define the dimensions of thepattern. The resist is then developed to remove the desired resistareas. A second layer of resist (positive or negative) is applied overthe first resist and portions of the device uncovered by the precisionmask exposure. A laser (with corresponding changes to the write patterndepending on the resist polarity) selects the portions on the secondresist layer, which are then developed to uncover the desired areas ofthe device for etching or other processing.

In the above embodiments, a laser beam is used to select the desiredpatterning. Irradiation through a non-precision configuration mask canreplace the non-precision direct-write step. The configuration mask canbe made by first applying an opaque layer onto a mask blank and thendepositing a resist layer over the opaque layer. The laser beam thenexposes portions of resist over the opaque layer, and desired areas ofthe mask are removed through conventional mask-making methods.Alternatively, a laser can remove desired opaque areas by directablation. Furthermore, a configuration mask can be modified by removingadditional opaque areas or re-used by applying another layer of opaquematerial and using the laser beam to expose or ablate new areas. The oldopaque material may be removed or left in place.

These above methods of combining precision and non-precision techniquescan be used to customize integrated circuits without requiring acustomized precision configuration mask. In an embodiment of the presentinvention, conductive lines and cut points are patterned and etched on aconductive layer. A metal (or other conductive layer) is deposited on asubstrate which contains circuit elements and at least one layerallowing connections to the circuit elements to the upper surface of thesubstrate. The metal layer is patterned using standard precision maskingtechniques to form a patterned interconnect layer comprising of spacesand conductive lines. The interconnect layer is then coated with aphotoresist layer, which can be patterned with the techniques of thepresent invention described above to form an ASIC blank. The standardprecision masks can be made with all possible cut-points for a certainuser, general application or other defining characteristic so that manydifferent types of ASICs can be created using one standard cut-pointmask. The laser-selected cut points are then etched away to customizethe device. After the remaining resist is stripped, the device can befinished by applying a passivation layer and etching pad locations, orfurther customization can be performed by applying a via layer anddepositing another metal layer for etching.

While the previous embodiment requires two patterning operations (one toform the interconnect layer and another to form the possible cutpoints), another embodiment of the present invention requires only onepatterning operation. After the metal layer is deposited on thesubstrate, a positive resist is formed on the metal layer, and theresist is exposed through a standard mask to define the image of themetal strips. A laser then exposes portions of the resist whereadditional etching of the underlying metal layer is desired todisconnect selected lines. The resist is developed, so that the portionsof the resist exposed through either the standard mask or by the laserbeam are removed. Etching is then performed on the uncovered portions ofthe metal layer. Although this embodiment requires only one maskingoperation, the accuracy and resolution of the laser beam needs to behigher than with the prior embodiments. In this embodiment, the beamcannot expose adjacent metal lines, but must still expose the entiredesired cut points.

In another embodiment of the present invention, customization byselecting desired vias to interconnect layers of a semiconductor deviceis provided. In this embodiment, an insulator layer, i.e. a dielectric,is formed on a patterned interconnect conductive layer and a layer ofphotoresist is deposited on the insulator layer. A layer of resist isapplied, and the resist is patterned with a standard precision via mask.A laser then selects or de-selects, depending on resist polarity, thedesired interconnections. After the resist is developed, the insulatorlayer is etched to uncover portions of the conductive layer to createvias at the desired locations. The remaining resist is then removed andone or more metal or conductive layers are deposited to fill the viasand to form an upper metal layer, thereby connecting the two metallayers at the desired locations.

In another embodiment, an alternative method is provided forinterconnecting layers according to the present invention. After thelayer of resist is patterned with the precision mask, the resist isdeveloped and the insulator layer is partially etched at all thepossible via locations. After the remaining resist is removed, anotherlayer of resist is applied to the insulator layer. A laser then selectsor de-selects, according to resist polarity, portions of the resistwhere vias are desired. After the resist is developed, another partialetching on the insulator layer is performed, resulting in a two-stepvia, where the laser defines the upper step and the standard via maskdefines the lower step. The device can then be finished as before toform the desired interconnections.

In yet other embodiments of the present invention, customization can beaccomplished by selectively forming connections within a conductor layerrather than between conductor layers. A metal layer is patterned byconventional methods so that gaps are present in the connecting stripsat all possible connection points. Next, an insulator or dielectriclayer is deposited on the metal layer. According to one embodiment, alayer of resist is applied to the insulator layer. The resist is exposedthrough a standard precision mask to define all possible connectionpoints. Next, a laser selects or de-selects, depending on resistpolarity, the desired connection points, and the resist is developed touncover the desired connection points. Etching is then performed toremove the portions of the insulator layer uncovered by the resist. Thedesired portions of the metal lines can be electrically connected withconventional methods.

In another embodiment, the two resist method can be used to defineconnections within lines. After exposing a first resist through astandard mask, the resist is developed and the insulator layer is thenetched to uncover all possible connection points. After the remainingresist is removed, a second resist layer is applied over the insulatorlayer. A laser then exposes areas where connections are desired or notdesired, depending on the resist polarity. The resist is then developedto uncover the selected connection points. Conventional methods, such asplating, can then be used to form the connections. The remaining resistis then removed and another layer of dielectric can be deposited toinsulate exposed gaps within the metal lines.

In the embodiments of the present invention which specify negativeresist, image reversal with a positive resist may be used to create anegative image in the resist, thereby accomplishing the same purpose aswith the use of negative resist.

A further advantage of the present invention is that the methodsprovided may be used to improve the repair of integrated circuits. Laserfuses, which are commonly used as repair elements, may be replaced with,for example, potential cut points on lines spaced at the minimumattainable conductor pitch even with larger laser beam spot sizes.

This invention will be more fully understood upon consideration of thedetailed description below taken together with the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-3 are illustrative sectional views representing a method of thepresent invention to pattern photoresist;

FIGS. 4-6 are illustrative sectional views representing another methodof the present invention to pattern photoresist;

FIGS. 7-9 are illustrative sectional views representing a method of thepresent invention to pattern resist line spaces;

FIGS. 10-12 are illustrative sectional views representing another methodof the present invention to pattern resist line spaces;

FIGS. 13-16 are illustrative sectional views representing an alternativemethod of the present invention for the non-precision lithography step;

FIGS. 17-19 are illustrative sectional views representing steps forcustomizing a non-precision mask according to one method of the presentinvention.

FIGS. 20-24B are illustrative sectional views representing the varioussteps for customizing an integrated circuit according to one method ofthe present invention by etching cut points;

FIG. 25 is a top view of a customized cut point device utilizing themethod of FIGS. 7-9;

FIGS. 26-28B are illustrative sectional views representing steps forcustomizing an integrated circuit according to another method of thepresent invention by etching vias;

FIGS. 29-31B are illustrative sectional views representing steps forcustomizing an integrated circuit according to another method of thepresent invention by etching vias;

FIGS. 32-36B are illustrative sectional views representing steps forcustomizing an integrated circuit according to another method of thepresent invention by forming connections within a layer; and

FIGS. 37-40 are illustrative sectional views representing steps forcustomizing an integrated circuit according to another method of thepresent invention by forming connections within a layer.

Use of the same reference numerals in different figures indicatesidentical or similar elements.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention provides a method for fabricating a customintegrated circuit (IC) by combining precision and non-precisionlithography without the need of a precision configuration mask. Thepresent invention uses standard precision masks to first define allpossible connections within an integrated circuit and then uses a laseror other targeting energy source to customize the IC.

FIGS. 1-3 illustrate one embodiment of the method of the presentinvention for patterning photoresist. In FIG. 1, a layer of negativepolarity photoresist ("resist") 10 is deposited on a wafer structure 11or any other surface to be acted upon after the resist is patterned.Resist 10 is then exposed by a light source through a standard precisionmask 12 or by other precision techniques. Standard mask 12 is opaque atall the possible resist openings for a general use or for a particularuser, leaving all possible openings on resist layer 10 unexposed. Whilemany possible openings normally exist, FIG. 1 shows only two possibleopenings 13 and 14 for illustrative purposes.

A non-precision laser direct-write machine or other targeting energybeam system 20 (hereinafter referred to generally as "laser") thenexposes the possible openings defined with the standard mask which areto remain protected by resist 10. In FIGS. 2A and 2B, representingrespective side and top views, possible opening 14 is exposed by laserbeam 20, which is typically, but not necessarily, larger than thedimensions defined by standard mask 12. Resist 10 is then developed touncover desired opening 13, as shown in FIG. 3. Structure 11 may then beetched, implanted or otherwise acted upon with the pattern of theselected openings defined by resist 10.

Openings are defined in this manner by a logical NOR of a precisionexposure (e.g., reduction stepper with standard precision masks) and alaser exposure, where the size of the openings are defined with thesmaller of the exposure steps, typically the precision exposure. Theselection of the openings are then determined by the laser exposure. Theorder of the two exposure steps may also be reversed. Regardless of theorder, the laser beam radius, as seen from FIG. 2B, can be approximatelyequal to the minimum center-to-center distance between openingplacements--1/2*minimum opening dimension--registration differencebetween two exposure steps without affecting other openings. This methodallows the density of the stepper system to be maintained while allowinga zero mask-cost configuration of the laser system for manufacturing.Furthermore, the amount of data to be written and the pixel densityrequirements for the laser system may be reduced, thereby reducing boththe time and cost to process a device when compared to an entirelylaser-based approach.

FIGS. 4-6 illustrate another embodiment of the present invention using alogical AND for patterning positive resist. In FIG. 4, a layer ofpositive resist 40 is deposited on structure 11. Resist 40 is exposed bya light source 41 through a precision mask 42 to define all possibleopenings 13 and 14. Exposure by light source 41 is kept below theclearing energy of resist 40, i.e., the amount of energy required tofully develop the resist. A laser 43 then exposes desired opening 14 tofully expose opening 14, as shown in respective side and top views,FIGS. 5A and 5B. The energy of the laser exposure step is similarly keptbelow the clearing energy of resist 40. However, the combined energy oflight source 41 and laser 43 is at least the clearing energy, andtherefore sufficient for complete resist development. FIG. 6 shows thearea which was exposed by both exposure steps developed to uncoveropening 14. Possible opening 13 and area 44, which were exposed by onlyone exposure step, remain covered with resist 40. Structure 11 may thenbe etched, implanted, or otherwise acted upon with the pattern of theselected openings defined by the logical AND of the mask and the laserpatterns.

As with the previous embodiment, the size and shape of the desiredopenings are defined by the precision mask, while the openings areselected by the laser. The exposure steps can similarly be reversed.However, while the allowable laser beam diameter is the same as for theprevious embodiment, the exposure requirements for the laser and maskare stricter. Specifically, the exposure time and energy must becontrolled such that each exposure step by itself does not exceed theclearing energy of the resist. On the other hand, an advantage of thismethod is that a dark-field precision mask can be used, which is lesssensitive to contamination causing defects. Furthermore, the ability touse positive resist may eliminate the need to add a negative resistprocess to the manufacturing line, which is a further advantage.

FIGS. 7-9 illustrate an embodiment of the present invention forpatterning lines and selected gaps within lines on a positive resistlayer. In FIG. 7, a layer of positive resist is deposited over astructure (not shown) to be patterned. The resist is exposed through aprecision mask or other precision technique to define spaces 71 (exposedareas) and lines 72 (unexposed areas). A laser then exposes gaps 73within lines 72, as shown in FIG. 8. The resist is developed to removeareas exposed by the precision mask or the laser, resulting in thedesired pattern of spaces 71 and gaps 73 uncovered by resist and lines72 covered by resist, as shown in FIG. 9. The structure may then beetched or acted upon with the pattern of the selected spaces and gapsdefined by the logical OR of the mask and the direct-write patterns. Thedimensions of the spaces and lines are determined by the precision step,while the gaps within the lines are determined by the laser step, withthe order of steps interchangeable. The diameter of the laser beam canbe approximately 2*space dimension+line dimension-2*registrationdifference between the two exposure steps without affecting adjacentlines, as seen from FIG. 8.

FIGS. 10-12 illustrate an embodiment of the present invention to patternlines and connections between lines on negative photoresist. FIG. 10shows a layer of negative resist applied over a structure (not shown) tobe patterned. The resist is exposed through a precision mask to definelines 101 where the resist is to cover the structure and to definespaces 102 where the resist is to be removed. A laser then exposes areas110 between lines 101 where additional resist is desired to cover thestructure, as shown in FIG. 11. The resist is developed and areas 120 ofthe resist left unexposed by the mask or laser are removed, resulting inthe pattern in FIG. 12. Unexposed areas 120, defined by the logical NORof the mask and the laser pattern, can then be etched or otherwise actedupon. The lines and spaces are defined by the precision step and theadditional resist or connections between the lines are defined by thenon-precision laser step, where the performance order of the steps canbe reversed if desired. The diameter of the laser exposure can beapproximately 2*line dimension+space dimension-2*registration differencebetween the two exposure steps without affecting adjacent spaces.

Whereas the above embodiments use one resist layer, FIGS. 13-16illustrate an embodiment using two resist layers for patterning adevice. A layer of resist is exposed through a precision mask anddeveloped to uncover all possible openings. The resist can be negativeor positive, accompanied with a corresponding change to the polarity ofthe mask, as shown in FIGS. 1 and 4, respectively. FIG. 13 shows aresist 130 with possible openings 13 and 14 after resist 130 isdeveloped and hardened if desired. Another layer of resist 140, whichcan be positive or negative, is deposited over resist 130 and openings13 and 14, as shown in FIG. 14. A laser 141 then exposes resist 140 inan area surrounding opening 14. In FIG. 15, resist 140 is positive.After laser 141 exposes desired opening 14, resist 140 is developed touncover opening 14. Alternatively, resist 140 can be negative as shownin FIG. 16. After laser 141 exposes openings 14 to be covered, resist140 is developed to uncover desired opening 13 while leaving a resistplug over opening 14. The structures in FIGS. 15 and 16 can then beetched or otherwise acted upon based on the patterned resist.

If both steps use the same polarity resist, the redundancy of the resistlayers can help reduce the defect density and allows the use of athinner resist layer for the precision lithography step withoutcompromising total resist thickness, which protects against etch erosionin areas of the circuit more than one-half the laser spot size away. Thereduction in resist thickness can be used to tailor the contour ofsubsequent etchings of the openings. However, if the two steps usedifferent polarity resists, the precision lithography step can beoptimized for size control and manufacturing ease, and the polarity ofthe direct-write step can be chosen separately to minimize the amount ofdata to be written, i.e., choose the resist polarity requiring the leastamount of laser exposures. As a result, throughput is increased and thecost of the direct-write step is reduced.

This two resist method can be similarly used in the non-precision stepsfor the embodiments of FIGS. 10-12 discussed above. Furthermore, thismethod can be used whereby the first and/or second resist layers neednot be kept during the entire processing step. For instance, eitherlithography step (precision or non-precision) may create a resistpattern which is transferred by etch, implantation or other technique toan underlying layer. The first resist can then be removed, with theunderlying pattern taking the place of the first resist. The secondresist is deposited and the structure subsequently processed.

Although the description of these embodiments use optical reductionsteppers and laser machines, they are equally applicable to anyprecision lithographic system used in conjunction with any direct-writesystem. It will also be understood by one skilled in the art that anegative resist process can be replaced with a positive resist processwith image reversal to achieve the same results. Additionally, theprocesses defined with single develop steps may be replaced withmultiple develop steps for positive resist processing.

In the above described methods, a laser is used to select desiredopenings in the resist. Alternatively, rather than using a laser beam toexpose the resist, irradiation through a laser-manufacturednon-precision mask can also be used. FIGS. 17-19 illustrate one way tomanufacture and use such a mask. In FIG. 17, a mask blank 170 is coveredwith an opaque material 175, which is covered by a positive or negativeresist layer 177. A laser 180 then exposes desired portions of resistlayer 177, and the selected portions of the resist and opaque layers areremoved using conventional methods. After the remaining resist 177 isremoved, mask 185 is formed as shown in FIGS. 18A and 18B. Analternative method of forming mask 185 uses direct ablation by a laserto remove opaque material 175, thereby eliminating the need for a resistlayer. Mask 185 can then be used in place of the laser step in theprevious embodiments for patterning the resist, as shown in FIG. 19 forexample.

Using laser manufactured non-precision configuration masks provides manyadvantages not found in using a laser beam directed on the resist layer.Using a configuration mask to select resist openings or connectionsallows an entire integrated circuit or a series of integrated circuitsto be exposed at once, thereby greatly reducing the time spent at theexposure step, increasing the throughput, and reducing manufacturingcosts when large volumes of units are required. In addition, laser useis greatly reduced because the laser beam is needed only to manufacturea configuration mask rather than to directly expose patterns on eachintegrated circuit. For example, if five hundred openings are requiredto customize or pattern an IC, it would require five million laserpulses to manufacture ten thousand devices of this design. However, if anon-precision configuration mask of the present invention is used, onlyfive hundred laser pulses are needed to produce the same number ofdevices.

The non-precision configuration mask provides additional advantages.Because of the reduced dimension control, registration, and volume ofdata requirements, the non-precision configuration mask is much lesscostly and time-consuming to manufacture than precision configurationmasks, which results in a reduction of the per design fixed costs forthe manufacture of the end units. The non-precision nature of the maskalso reduces the requirements, and therefore the cost, of the reductionstepper (or aligner) used to apply the image of the configuration maskto the resist. Using, preferably, an older and less costly generationstepper with lower resolution capability than that of the standardprecision masks allows the laser manufactured non-precision mask to beless precisely made because small imperfections in the edge definitionof the mask and small splatters of debris or foreign matter will not beresolved onto the resist. As a result, the susceptibility to defects inthe manufacture of the mask or to later contamination during storage oruse of the mask is reduced. Time and costs can be further reducedbecause the masks can be re-used by simply removing the old layer ofopaque material, then applying a new layer of opaque material andforming the new desired exposure points to create a new configurationmask. The following description uses the above-described methods tocustomize integrated circuits at various processing steps.

FIGS. 20-24B illustrate customizing a gate array by patterning cutpoints according to the present invention. In FIG. 20, a metal layer201, to be customized, is deposited on a substrate 202 and a layer ofphotoresist (positive or negative) 203 is then formed on metal layer201. Substrate 202 includes circuit elements, such as logic gates ortransistors, and may include additional conductive or connector layers,contact layers or insulation layers. Metal layer 201 provides contactwith these lower layers and circuit elements. Resist 203 is then exposedthrough a standard mask by intense light to form a patternedinterconnect layer comprising lines 211 and spaces 212, as shown in atop view in FIG. 21. Next, resist 203 is developed to remove theselected areas of resist 203 (exposed portions if positive resist,unexposed portions if negative resist), uncovering portions of metallayer 201. Metal layer 201 is then etched and the remaining resist isremoved. Thus, the surface of the substrate is now covered by metalconnection lines 221 to be customized, as shown in FIG. 22.

In FIGS. 23A and 23B, a layer of resist 231 is applied over metalconnection lines 221 and spaces 230 over substrate 202 and thenpatterned with a precision cut-point mask, using methods discussed withrespect to FIGS. 1 or 4 to define desired cut points 232 and 233. Thisstructure forms an ASIC blank, which can now be customized with one ofthe non-precision steps discussed above. Metal connection lines 221 arethen etched through the selected openings of the resist, followed byremoval of the remaining resist, as shown in FIGS. 24A and 24B, leavinga customized metal layer with cut point 233 etched.

At this point, a planarization or passivation layer may be applied, thepad locations are etched, and the device is therefore completely formed.Alternatively, an insulation layer may be applied, via locations arethen etched, and one or more metal or conductive layers can be depositedand patterned using the method of the present invention or standardmasking techniques, followed by passivation and pad masking.

Cut points within conducting lines can also be etched with a singleetching step according to the method of FIGS. 7-9. A positive resist isdeposited on a metal or other conducting layer and patterned with aprecision mask, as in FIG. 7, forming an ASIC blank. After patterningthe resist with a non-precision configuration step, spaces 230 and gaps252, uncovered by the resist, are etched, and the remaining resist isremoved, as shown in FIG. 25. The advantage of this method is that astandard cut point mask is not needed, thereby saving both cost andcycle time for producing an ASIC. However, contrary to the priormethods, this method requires that the laser beam be more accurate sothat the beam does not expose adjacent lines in metal lines 221, wherethe beam size is limited to the diameter provided above with respect toFIGS. 7-9.

FIGS. 26-28B illustrate interconnecting two metal or conductive layersaccording to the present invention. In FIG. 26, a layer of dielectric orother insulating material 260 is deposited on a metal or conductivelayer, which has been patterned with metal interconnection lines 221using conventional techniques to form a patterned interconnect layer.Furthermore, FIG. 26 shows a resist 261 (positive or negative) depositedon dielectric layer 260, which has been exposed through a standardprecision via mask to define all possible via locations 262 and 263using methods discussed above. The device formed is an ASIC blank thatcan now be customized with a non-precision step. After the desired vialocations are selected with the non-precision step, dielectric layer 260is etched to uncover desired via location 262 on metal lines 221 and theremaining resist removed, as shown in FIG. 27. A second metal orconductive layer is deposited and patterned to form the desiredconnections. FIGS. 28A and 28B are respective side and top views showinga second metal layer line 280 connected to a first metal layer line 281of lines 221 and a second metal layer line 282 insulated from firstlayer metal line 283 of metal lines 221.

FIGS. 29-30B show an alternative method for interconnecting layersaccording to the present invention. In FIG. 29, dielectric layer 260 ispartially etched at possible via locations 290 and 291 defined by astandard precision via mask and the remaining portions of resist aresubsequently removed. After another layer of resist is deposited overdielectric layer 260, a non-precision laser selects the desiredinterconnections. After the resist is developed so that openings areprovided at the uncovered portions, dielectric layer 260 is etched tometal lines 221 at via location 291 but not via location 290, resultingin a two-step via, in which the laser defines the upper step and thestandard precision via mask defines the lower step. The remainingportions of the resist are then removed, resulting in the device shownin FIGS. 30A and 30B. FIGS. 30A and 30B show connection point 291 formedby an opening through dielectric 260 to metal connection lines 221 whilepossible connection point 290 remains insulated. Another metal layer 300can then be deposited and patterned to form the desiredinterconnections, as shown in FIGS. 31A and 31B. This method has theadditional advantage of reducing line capacitance because the two-stepvias accommodate a thicker dielectric thickness over areas not adjacentto the vias without violating the via step height and aspect ratiolimitations of a given process technology.

According to another aspect of the present invention, connections can beformed within each layer, rather than between layers, to customizeintegrated circuits. FIGS. 32-40 illustrate two alternative methods. InFIGS. 32-36B all possible connection points are initially covered by adielectric layer, whereas in FIGS. 37-40, all possible connection pointsare initially exposed by etching the dielectric layer.

FIG. 32 shows a top view of a metal or conductive layer deposited on aninsulating layer to provide connections with the circuit elements inother layers of the semiconductor structure. The metal layer ispatterned to provide metal lines 310 with gaps 309 and 311 at allpossible connection points to form a patterned interconnect layer. Adielectric 312 is then deposited on the metal lines 310, as shown inFIG. 33. In FIG. 34, a layer of resist (positive or negative) 330 isthen provided on dielectric layer 312 and exposed through a standardprecision mask to define openings at all possible connection points 309and 311, e.g. potential openings 331 and 332, to form an ASIC blank. Alaser beam is used to select area 332 of resist 330 above connectionpoint 311 which is to be connected. In FIG. 35, resist layer 330 isdeveloped, dielectric layer 312 is then etched to uncover the desiredconnection point 311 while leaving possible connection point 309insulated. Then, the remaining portions of resist 330 are removed. InFIGS. 36A and 36B, uncovered ends 350 of metal line 310 are bridged by aconductive material 351 to form the desired connections. The conductivematerial can be provided by plating, for example. Other conventionalconnection techniques may also be used.

FIGS. 37-40 illustrate connecting metal strips within a layer accordingto the present invention using the method of two resists. After the stepshown in FIG. 34, resist 330, which can be positive or negative, isdeveloped to create openings above all possible connection points 309and 311. Dielectric layer 312 is then etched to uncover the possibleconnection points 309 and 311. The remaining portions of resist 330 arethen removed, as shown in FIG. 37. In FIG. 38, another layer of positiveor negative resist 370 is deposited on dielectric layer 312, and a laserexposes resist 370 in areas above where connections are desired(positive resist) or where connections are to remain open (negativeresist). Resist 370 is then developed to remove the portions of resist370 selected by the laser step. In FIG. 39, positive resist is used sothat connection point 309 is uncovered and possible connection point 311remains protected by resist 370. The uncovered ends 350 of metal line310 are bridged by a conductive material 351 to form a connection atpoint 309, resist 370 is removed, and another dielectric layer 390 maybe deposited, as shown in FIG. 40.

The present invention offers several advantages over previous methods ofcustomizing integrated circuits. Because no precision configuration maskis required for each different customization, both the cost andlead-time to produce an application-specific integrated circuit (ASIC)are reduced. In the present invention, the only precision masks requiredare those used to form the ASIC blank which is then available for use bya large number of possible designs. ASIC blanks can be stored until theyare ready to be customized, which then only requires a laser beam toselectively define the desired areas to be connected or disconnected.Prior methods require manufacturing precision configuration masks foreach new design, which greatly increases the cost and latency betweenthe time the user provides the design to the manufacturer and the timethe user receives the ASIC. Therefore, per design costs and the time todelivery are reduced. Furthermore, since the time required to preparefor the actual customization of the die is now only the time needed todetermine the coordinates and control signals for the laser machine,near instantaneous release of the design to the production facility ispossible when compared to the time required to manufacture and check aprecision configuration mask. In addition, the per design expense of theprecision configuration masks are eliminated.

Additionally, the production of small numbers of units becomeseconomically feasible with the present invention. Often the need tocheck system designs with actual working ICs leads to the need forprototype units to be built in very small quantities, often two dozen orless. The present invention allows this to be done economically by botheliminating the need for precision configuration masks and allowingmultiple custom devices to be built on the same wafer. Previous methodswhich required the production of one or more precision configurationmasks for each design would require that large numbers of units beproduced in order for the per-design mask purchase costs to amortizedown to reasonable per unit costs. The present invention allows fordesigns to be implemented without such costs and the need to amortizethem, such that production of very small lot quantities, includingquantities of less than a full wafer, become economical.

An alternative use of laser beams in the industry is to use lasers toblast connecting links between circuits (laser fuses) allowingcustomization or repair of circuitry. The present invention hasadvantages over this previous method in that the energy delivery to thewafer by the laser beam is very low. Consequently, cut points orconnection points in the present invention can be placed above activecircuitry in contrast to laser fuses of previous techniques, whichdictate that circuitry or conductors lie outside the laser beam diameterin order to avoid damage. The methods described above further eliminateproblems associated with laser fuses. Common repair practices includeusing laser-blown fuses, laser-connected antifuses or electricallyprogrammed bits to control the deactivation of defective circuitsections and the activation of replacement circuit sections. Usingmethods of the present invention, activation and deactivation can becontrolled by conductors, which may be selectively connected ordisconnected for each specific IC to effectuate repairs within a smallerdie area and with a tighter pitch between elements than with priortechniques. With prior methods, laser fuses and conductors, which carrysignals in and out of the fuses, must be separated from one another bymore than the minimum pitch of the conductor layer on which they areformed because current resolution of laser spot sizes are below thedimensions of lines and spaces formed through precision maskingtechniques. The present invention eliminates this problem by allowinglaser fuses to be replaced with, for example, potential cut points onlines spaced at the minimum attainable conductor pitch, regardless ofthe laser beam size.

The present invention also reduces cost of the laser machine due to thelower energy delivery and the less exacting energy delivery controlsneeded to avoid wafer damage. The cost of the laser machine may also bereduced because the spot size requirements are less restrictive in thepresent invention than previous methods utilizing laser fuses. This isbecause the only area affected by the beam is defined by the overlap ofthe standard precision cut-point mask and the area exposed (or not) bythe laser beam. The dimensions of this overlap are therefore determinedby the dimensions of the precision cut-point mask rather than the laserbeam size.

The detailed description is provided above to illustrate specificembodiments of the present invention and is not intended to be limiting.Numerous modifications and variations are possible within the scope ofthe present invention. For example, these techniques are not limited toproduction of ASICs, but apply to any photo-defined process requiringthe alteration of the photo-defined areas beyond one standard pattern.Other applications of these techniques include the production ofread-only memories (ROMs), the selection of alternative modes ofoperation of standard devices, and the repair of memory or logiccircuits. The present invention is defined by the appended claims.

What is claimed is:
 1. A method for customizing or repairing integratedcircuits comprising:providing a substrate in which circuit elements havebeen formed, said circuit elements having connection points provided atan upper surface of the substrate; forming a patterned interconnectlayer over said upper surface of the substrate; depositing a positivephotoresist layer over said patterned interconnect layer; exposing saidphotoresist layer to define possible cut points on said patternedinterconnect layer; exposing said photoresist layer to define desiredcut points; and developing and removing said first photoresist touncover the desired cut points on said patterned interconnect layer, andetching said patterned interconnect layer at the desired cut points,wherein a light exposure through a standard cut-point mask is used todefine said possible cut points on the patterned interconnect layer byexposing all possible cut points with an energy less than a clearingenergy of said photoresist, and wherein a non-precision technique isused to define desired cut points by exposing said photoresist layerwith an energy less than the clearing energy of said photoresist, thenon-precision technique energy when combined with the standard cut-pointmask exposure energy being at least the clearing energy of saidphotoresist.
 2. The method of claim 1, wherein the defining possible cutpoints follows the defining desired cut points.
 3. The method of claim1, wherein the non-precision technique is exposure with a targetingenergy beam.
 4. The method of claim 1, wherein the non-precisiontechnique is exposure through a non-precision mask.
 5. A method forcustomizing or repairing integrated circuits comprising:providing asubstrate in which circuit elements have been formed, said circuitelements having connection points provided at an upper surface of thesubstrate; forming a patterned interconnect layer over said uppersurface of the substrate; depositing a first photoresist layer over saidpatterned interconnect layer; exposing said first photoresist layer todefine first cut points on said patterned interconnect layer; developingand removing the first photoresist layer at the first cut points, anddepositing a second photoresist layer over the first photoresist layer;exposing said second photoresist layer to define second cut points; anddeveloping and removing said second photoresist to uncover the secondcut points on said patterned interconnect layer, and etching saidpatterned interconnect layer at the second cut points.
 6. The method ofclaim 5 wherein light exposure through a standard cut-point mask is usedto define the first cut points, wherein the first cut points arepossible cut points and the second cut points are desired cut points. 7.The method of claim 6 wherein exposure by a targeting energy beam isused to define the second cut points.
 8. The method of claim 5, whereinsaid first and second photoresist are of same polarity.
 9. The method ofclaim 5, wherein said first and second photoresist are of oppositepolarity.
 10. The method of claim 5, wherein the first cut points aredesired cut points and the second cut points are possible cut points.11. The method of claim 5, wherein the first cut points are possible cutpoints and the second cut points are desired cut points.